Consult with us from the initial design stages and prototyping stages.

Noritake's Thick Film Circuit Substrates

For applications requiring heat resistance, heat dissipation, and environmental durability. We support projects low- to medium-volume production through mass production.

PROBLEMAre you facing any of these challenges with circuit substrates?

You know the operating environment and required performance, but the substrate structure, materials, or prototyping partner have not yet been decided.

  • 01

    Concerned about the heat resistance of FR-4

  • 02

    Concerned about moisture, chemicals, or temperature changes

  • 03

    Unable to find an finding a supplier for small-volume production

  • 04

    Difficult to consult when specifications are not yet finalized

  • 05

    Need to plan for mass production after prototyping

ANSWERNoritake's ceramic thick-film circuit substrates can help solve these challenges.

Rely on us for development prototypes through mass production.

Flexible development for prototyping and low- to medium-volume production through mass production.

High reliability adopted for automotive and medical components

WHY NORITAKEWhy Choose Noritake

Thick-film circuit substrates are jointly developed products that require detailed study of performance,
operating environment, quantity, evaluation conditions, and other factors.
Noritake provides consistent support from initial design stage through mass production.

  • 01

    Supports small-lot prototyping through mass production.

    We propose a flexible process from prototyping to production transfer according to your planned quantity.

  • 02

    Technical support from the design stage

    You can consult with us from the early study stage on substrate structure, conductor materials, resistors, and other elements according to the required performance.

  • 03

    Custom development of electronic pastes

    In collaboration with the Noritake Group's electronic paste business, we can also develop custom materials tailored to specific applications.

TECHNOLOGYWhat Are Noritake's Thick Film Circuit Substrates?

Noritake's thick-film circuit substrates are circuit substrates formed by creating conductors,
resistors, protective layers, and other elements on ceramic substrates.
They are suitable for applications that require heat dissipation, insulation, and heat resistance at the same time.

Benefits of Thick Film Circuit Substrates

  • Heat dissipation
    and insulation

    Ceramic substrates are insulating materials themselves and have a structure that facilitates heat dissipation.

  • Resistant to
    temperature changes

    Low thermal expansion enables designs that take temperature cycling into account.

  • Excellent
    environmental durability

    They are suitable for applications that require resistance to moisture, chemicals, and high-temperature environments.

  • Low noise

    Low-loss signal characteristics make them well suited for high-frequency circuits and areas around sensors.

COMPARISONDifferences Between Ceramic Substrates and Other Substrates

FR-4 substrates are candidates for general environments, and aluminum substrates are candidates when heat dissipation is emphasized.
However, when heat resistance, heat dissipation, insulation, and environmental durability are all important, ceramic thick-film circuit substrates become the primary candidate.

For applications that require heat resistance, insulation, environmental durability, and long-term reliability at the same time.

For electronic circuits in general environments where cost is a priority.

For relatively simple circuit structures where high-temperature performance is a priority.

Ceramic substrate
(96% alumina)
FR-4 substrate
(glass epoxy)
Aluminum substrate
(aluminum base)

Thermal conductivity

Approx. 23W/(m・K)
The substrate itself serves as a heat sink.
Approx. 0.3W/(m・K)
Poor heat dissipation
Approx. 2W/(m・K)
Weak thermal conduction due to the insulating layer

Coefficient of thermal expansion

Approx. 8×10-6/℃
Low expansion and less prone to failure
Approx. 14×10-6/℃
Risk of solder cracking
Approx. 24×10-6/℃
Significantly affected by metal expansion

Flexural strength

Approx. 400MPa
Very hard
Approx. 540MPa
Flexible, but low in strength
The base metal is strong, but prone to delamination.

Continuous operating temperature

Excellent
Excellent thermal resistance
Not suitable
Risk of carbonization
Not suitable
Degradation of dielectric layer

Dielectric tangent

Excellent
Extremely low loss
Not suitable
High loss
Not suitable
Depends on the insulating layer

Excellent resistance to deterioration
Chemical resistance

Excellent
Excellent resistance to deterioration
Not suitable
Weak against moisture and chemicals
Not suitable
Concerns about aging degradation and corrosion

STRUCTURE & SPECSSubstrate Structures and Standard Specifications Available for Prototyping
and Production

We support single-layer, through-hole, crossover, and multilayer structures according to the circuit.
Based on standard specifications, we support substrate design from the prototype stage through production.

Substrate Structures

  • 01

    Single-layer structure

    This is the simplest structure, with a thick-film circuit formed on one side of the substrate.

  • 02

    Crossover structure

    This is a low-cost partial multilayer structure in which jumpers are partially formed using insulating layers and conductors.

  • 03

    Through-hole structure

    This structure uses through-holes and forms thick-film circuits on both sides of the substrate.

  • 04

    Multilayer structure

    This structure forms multiple multilayer circuits by stacking insulators and conductors.

Standard Specifications (Partial)

  • Substrate

    Material: 96% alumina
    Dimensions: 50.4 × 50.4 to 129 × 116 mm, etc.

  • Conductor

    Silver (Ag) resistance: 2 - 3 mΩ
    Gold (Au) resistance: 2 - 4 mΩ, etc.

  • Resistor

    Resistance: 10 mΩ/□ to 10 MΩ/□
    Standard tolerance: ±5%, etc.

  • Protective layer

    Distance from glass to substrate edge: +-0.2 mm, etc.

APPLICATIONS Applications and Adoption Examples

They are used in fields requiring high reliability, such as automotive, medical, and industrial equipment applications.

  • Automotive

    Reliability in high-temperature, vibration, and long-term operating environments

    Various sensors, LEDs, and hybrid ICs

    Ceramic substrates are selected for automotive environments exposed to heat and vibration because they can maintain stable circuit characteristics.

  • Medical

    Dimensional stability and long-term reliability supporting sensor accuracy

    Medical pressure sensors

    Highly reliable ceramic substrates with low deformation are used in high-precision medical sensors./p>

  • Industrial

    Resistance to harsh environments such as heat, chemicals, and moisture

    Temperature, flow, and electronic ion sensors, etc.

    Environmental durability, insulation, and long-term reliability help industrial equipment operate stably in harsh environments.

CONSULTATION PROCESSProcess from Development to Delivery

We support your project from the early concept stage?not just after specifications have been finalized.

  • STEP 1

    Development meeting

    We confirm the operating environment, required performance, quantity, and schedule.

  • STEP 2

    Prototype delivery

    We produce and deliver prototypes according to your requirements.

  • STEP 3

    Prototype evaluation

    Please evaluate the performance and provide your feedback.

  • STEP 4

    Approval

    Your approval is required before starting mass production.

  • STEP 5

    Production delivery

    We deliver based on the production specifications.

FAQFrequently Asked Questions

  • Can we consult with you even if the specifications have not yet been finalized?

    Yes. We support you from the early design stage, considering required performance and operating conditions, and supporting discussions on substrate structure, materials, conductors, resistors, and other elements.

  • Can we consult with you for small-lot prototyping only?

    Yes. We propose a process tailored to your planned quantity and development status, from development prototyping through medium-volume production.

  • Can you handle dimensions or materials outside the standard specifications?

    We are also available to discuss requirements outside standard specifications. After confirming the required specifications and operating environment, we will evaluate feasibility.

  • What information is needed for consultation?

    Please provide any information available, such as the operating environment, required performance, expected quantity, size, operating temperature, and substrate materials under consideration.
    You can consult with us even if the specifications have not yet been finalized.

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