TECHNOLOGY
High Precision Mounting Technology
High Precision Mounting Technology
Thick-film high precision pattern formation to align with Thin Film patterns
Aluminum wire bonding assures higher reliable connection between circuit board terminals and mounted semiconductor chips.
| Bonding Pitch | 60μm min. |
|---|---|
| Supported Chip Size | 2.0mm min. |
| Wire Material | Aluminum wire |
| Application in VFD | Driver chip mounting inside vacuum enclosure, Connections |
* Please inquire if you have higher requirements
※左右にフリックすると表がスライドします
-
Thin Film Technology
-
Thick Film Technology
-
High precision Mounting Technology
-
High Precision Mounting Technology
-
-
Vacuum Technology
-
Embedding Soft and Hardware Technology
