TECHNOLOGY
High Precision Mounting Technology
High Precision Mounting Technology
Thick-film high precision pattern formation to align with Thin Film patterns
Aluminum wire bonding assures higher reliable connection between circuit board terminals and mounted semiconductor chips.
| Bonding Pitch | 60μm min. |
|---|---|
| Supported Chip Size | 2.0mm min. |
| Wire Material | Aluminum wire |
| Application in VFD | Driver chip mounting inside vacuum enclosure, Connections |
* Please inquire if you have higher requirements
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Thin Film Technology
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Thick Film Technology
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High precision Mounting Technology
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High Precision Mounting Technology
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Vacuum Technology
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Embedding Soft and Hardware Technology
